Products 4-Layer FR4 PCB

4-Layer FR4 PCB

For high TG or HiTG, the glass transition temperature (TG) is 115°C to 200°C, depending on the manufacturing method and the resin used. A standard FR-4 PCB will consist of one FR-4 layer sandwiched between two thin copper stacks.

Material Fr4
Plate thickness 1.6mm
Copper thickness 1OZ
Minimum line 6 million
Minimum hole 0.3MM
Surface treatment HASL lead free

Prototype to Full Turn-Key Assembly

Through-Hole Lead-Free Wave Soldering

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  • Description
  • Specification

4-Layer FR4 PCB: Elevating Connectivity and Performance

Unveil a new dimension of PCB technology with our 4-Layer FR4 PCB, meticulously crafted to redefine your electronic designs. Designed with precision and engineered for excellence, this circuit board encapsulates innovation, reliability, and versatility, making it an indispensable foundation for various applications.

Key Features: 4-Layer FR4 PCB

1. Enhanced Functionality: With four distinct layers intricately woven together, our 4-Layer FR4 PCB offers an exceptional platform for increased functionality. Harness the power of additional routing and signaling layers, empowering your circuits to carry out intricate tasks with finesse.

2. Efficient Signal Integrity: Designed to accommodate complex designs, this PCB boasts unparalleled signal integrity. The symphony of four layers allows for separate power and ground planes, minimizing interference and ensuring your signals remain strong and clear.

3. Optimal Thermal Management: Our 4-Layer FR4 PCB takes thermal management to the next level. The dual-plane structure facilitates efficient heat dissipation, preventing hotspots and ensuring your components operate at peak performance.

4. Compact Design: Embrace compactness without compromise. The four-layer configuration condenses the board’s footprint, making it ideal for space-constrained applications without sacrificing performance or functionality.

5. Versatility Across Industries: This PCB shines across industries from consumer electronics to industrial automation. Its adaptability makes it a powerful asset in medical and telecommunications applications.

6. Robust and Reliable: This PCB offers unwavering reliability crafted from FR4 materials renowned for their mechanical strength and insulation properties. It maintains stability even in challenging environments, ensuring your electronics are built to last.

7. Seamless Integration: The 4-Layer FR4 PCB seamlessly integrates into your existing designs. Its standardized form factor and compatibility with various components and connectors streamline the integration process, saving you time and effort.

8. Design Freedom: Enjoy newfound design freedom with the additional layers at your disposal. Whether you’re optimizing routing, enhancing power distribution, or managing impedance, this PCB empowers you to innovate without constraints.

Feature Capability
Material FR-4 Standard Tg 140°C, FR4-High Tg 170°C
Min. Track/Spacing For External layers:
4oz Cu 10mil/13mil, 5oz Cu 12mil/15mil, 6oz Cu 15mil/15mil

For Internal layers:
4oz Cu 8mil/8mil, 5oz Cu 10mil/10mil, 6oz Cu 12mil/12mil
Min. Hole Size 0.15 ~ 0.3mm
Max Outer Layer Copper Weight (Finished) 12oz
Max Inner Layer Copper Weight 12oz
Board Thickness 0.6-6mm
Surface Finishing HASL lead-free, Immersion gold, OSP, Hard Gold, Immersion Silver, Enepig
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen White, Black
Via Process Tenting Vias, Plugged Vias, Vias not covered
Testing Fly Probe Testing (Free) and A.O.I. testing
Build time 5-15 days
Lead time 2-3 days

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