-
PCBMay Provides Different Types of PCB Stack-up
-
Wenshu: Your Premier PCB Supplier of Your PCB Stackup in China.
| ltem | Capability |
|---|---|
| Quality Grade | Standard IPC 2 and IPC 3 |
| Number of Layers | 2 – 40layers |
| Order Quantity | 1pc – 1Million+pcs |
| Build Time | 24H – 4weeks |
| Material | S1150G, S1165, S1000-2 |
| Board Size | Min 5*5mm | Max 500*650mm |
| Board Thickness | 0.4mm – 6.5mm |
| Copper Weight (Finished) | 0.5oz – 10.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Solder Mask Color | White, Black, Yellow |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 6mil |
Looking for a reputable PCB stack-up manufacturer? You’re in the right place. With over 12 years of experience in PCB manufacturing and a global customer base of 3000+, Wenshu is your trusted partner.
Understanding the significance of PCB stack-up in the design and manufacturing process, we emphasize its importance. When crafting your PCB, careful attention to the stack-up is crucial.
At Wenshu, we specialize in tailoring layer stack-ups for various multilayer PCBs, ranging from 4 layers to 40 layers. While there’s no strict layer limit, our maximum at Wenshu is 40 layers.
We recognize that while some customers have specific stack-up requirements, others might not. In such cases, our skilled engineering team provides a standard PCB stack-up for your review and approval before proceeding to production.
Frequently Asked Questions
How do OEM PCBs and standard PCBs contrast in design?
How does Wenshu go about the design process when crafting their PCBs?
What techniques are applied to ensure product reliability and quality in Wenshu PCB design?
What practices are embraced to uphold confidentiality during the manufacturing process of Wenshu PCBs?
Why Choose Us
Reliability
Crafted with precision and manufactured under stringent quality control, our PCB stackup is designed to meet the demands of mission-critical applications.
Advanced Applications
Ideal for applications demanding intricate circuitry, such as advanced communication systems, high-speed data transfer, and complex industrial control systems.
EMI Shielding
The multiple layers aid in electromagnetic interference (EMI) shielding, enhancing the overall electromagnetic compatibility of the PCB.
High-Density Components
The stackup accommodates densely packed components, enabling the creation of compact and efficient electronic systems.
