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Capability
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BGA Assembly Capabilities
| ltem | Capability |
|---|---|
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| Size | 50*50mm~510*460mm |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| Min Package | 01005 (0.4mm*0.2mm) |
| Max Package | No limit |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
| Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| Component Sourcing | Turnkey (All components sourced by Wenshu), Partial turnkey, Kitted/Consigned |
| BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
| Stencil | Stencil with or without frame (offered free by Wenshu) |
| Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
Comprehensive BGA PCB Assembly Solutions
At the heart of our services lies a comprehensive suite of BGA (Ball Grid Array) PCB assembly solutions, meticulously crafted to meet your intricate electronic manufacturing needs. Our expertise spans a wide spectrum of BGA-related services, ensuring that every stage of the assembly process is not only executed flawlessly but also contributes to the overall efficiency and quality of your electronic products.
BGA Prototype Development: We understand the critical importance of prototyping in the product development cycle. Our BGA prototype development services offer you the opportunity to test and iterate your designs before committing to full-scale production. This ensures that any issues are identified and resolved early, saving you time and resources down the line.
BGA PCB Assembly: With our seasoned professionals and state-of-the-art equipment, we excel in BGA PCB assembly. The intricate task of mounting ball grid array components onto circuit boards is executed with precision and expertise, ensuring optimal soldering and electrical connections for reliable performance.
BGA Component Removal and Replacement: In the ever-evolving landscape of electronics, the need to upgrade or replace components is inevitable. Our services extend to BGA component removal and replacement, allowing for seamless upgrades, repairs, and adaptations to the latest technologies.
BGA Rework and Reballing: When issues arise with BGA solder joints, our BGA rework and reballing services come into play. Whether it’s correcting soldering defects or re-establishing connections, we have the tools and skills to restore the integrity of your PCB assemblies.
BGA PCB Assembly Inspection: Our commitment to quality extends to rigorous inspection processes. We employ a variety of techniques, including optical and mechanical inspection, to ensure the accuracy and reliability of your BGA assemblies. X-ray inspection, a vital part of our process, enables us to scrutinize solder joints with unparalleled precision.
By offering this comprehensive range of BGA PCB assembly solutions, we empower you to navigate the intricate landscape of modern electronics with confidence. Whether you’re in the initial stages of design or require intricate rework, our services are designed to streamline your production cycle and bring your electronic innovations to life.
Advantages of BGA PCB Assembly Excellence
Optimal Space Utilization: BGA PCB layout maximizes space utilization, allowing advanced component integration and creating sleeker, lighter devices.
Enhanced Thermal Performance: BGA’s design efficiently dissipates component-generated heat through spherical balls, aided by an extensive contact area, ensuring prolonged operation.
Elevated Electrical Conductivity: Minimal die-to-circuit board distance enhances electrical conductivity. The absence of through-holes and comprehensive solder ball coverage minimize unused spaces.
Simplified Assembly and Management: BGA simplifies assembly through direct package-to-board soldering using solder balls, contrasting with complex PCB assembly methods.
Reduced Lead Vulnerability: BGA’s robust solid solder balls fortify leads, reducing the risk of damage during operations.
Frequently Asked Questions
1. OEM PCB vs. Standard PCB: How Do They Differ?
2. What Steps Comprise Wenshu PCB Design Process?
3. Ensuring Reliability and Quality in Wenshu PCB Design: How?
4. Strategies for Confidentiality in Wenshu PCB Manufacturing
Why Choose Us
Responsive Service Approach
From the initial interaction to final delivery, our service thrives on efficiency, propelled by state-of-the-art automated SMT and lead-free through-hole wave soldering.
Extensive Expertise
Benefit from our 18-year journey in delivering impeccable build services. Our extensive experience ensures products are produced to the highest benchmarks.
Turnkey Box Build Assembly
NEWHONEST offers a holistic box-build solution, guiding you through mechanical assembly. This encompasses component sourcing, design, manufacturing, testing, and repair services.
Uncompromising Quality
Certifications underscore our commitment to quality. With ISO 9001, ISO 13485, IPC-A-610, RoHS, and Lead-Free process certifications, along with REACH compliance, our products and services maintain exceptional standards.
