• AOI ：Automated Optical Inspection

• BGA：Ball Grid Array

• BOM：Bill Of Material

• Bonding：Bonding

• COB ：Chip On Board

• COG ：Chip on Glass

• cBGA：ceramic BGA

• CSTN：

• DIP ：Dual In-line Package

• EMS ：Electronic Manufacturing Services

• FR-4 ：flame-retardant substrate

• FOG ：Flexible printed circuits board On Glass

• FPC：Flexible Printed Circuit

• FPCBA ：Flexible Printed Circuit Assembly

• IC ：integrate circuit

• ICT： In Cricult Testing

• IQC ：Incoming Quality Control

• LCD ：Liquid Crystal Display

• LCM：Liquid Crystal Module

• LED ：Light Emitting Diode

• ODM ：Original Design Manufacturer

• OEM ：Original Equipment Manufacture

• PCB： Printed Circuie Board

• PCBA： Printed Cirruit Board Assembly

• PTH： Plated Thru Hole

• QA： Final Quality Assurance

• QC： Incoming Quality Control

• QFP：Quad Flat Pockage

• SMD ： Surface Mount Devices

• SMT： Surface Mounted Technology

• STN ：

• TAB：Tape Automaticed Bonding

• TFT：Thin Film Transistor

• TQFP ：tape quad flat package

• uBGA ：micro BGA

• underfill ：

• single-sided printed board

• double-sided printed board

• multilayer printed board

• Compact Flash Memory Card

• funtion testing