Technology
No. Of Layers: 1-6
Maximum Dimension: 500mm×1000mm
Minimum Thickness: Single Side Board 0.06mm; Double Sides Board 0.1mm;
Three Layers Board 0.2mm; Four Layers Board 0.26mm;
Five Layers Board 0.32mm; Six Layers Board 0.38mm
Minimum Track Width/Spacing: 3mil/3mil
Minimum Hole Size: 0.15mm
Products Tolerance: ± 0.05mm (Stencil Mold) ± 0.1mm (Mold Punching)
Minimum Hole Spacing: 0.1mm
Surface Finishing: HAL; HASL; Nickel; Immersion Gold; Gold Flash; Immersion Silver; OSP
Materiel: Thickness of Cu: 1/40Z、1/20Z、10Z、1.50Z、20Z
Thickness of Pl: 1/2mil、1-10mil
Thickness of ADH: 1/2mil、1mil
Assembly: SMT
Production process:
Single Side Board
Materiel Cutting → Drilling → Circuit Pattern → (Whole Board Gold Plating) →Etching → Inspection → Solder Mask → Hot Air Leveling →Character Printing →Outline Fabrication → Outgoing Inspection
Double Sides HAL Board
Materiel Cutting → Drilling → Plated Through Hole →Circuit Pattern → Plating, Etching → Drilling → Inspection → Solder Mask → Gold Plating → Hot Air Leveling →Character Printing → Outline Fabrication → Testing → Outgoing Inspection
Double Sides Nickel, Gold Flash Board
Materiel Cutting → Drilling → Plated Through Hole →Circuit Pattern → Plating, Etching → Drilling → Inspection → Solder Mask →Character Printing →Outline Fabrication → Testing → Outgoing Inspection
Multi Layer HAL Board
Materiel Cutting → Drilling → Internal Circuit Pattern → Internal Etching → Inspection → Melanize → Pressing → Drilling → Plated Through Hole → External Circuit Pattern → Plating, Etching → Drilling → Inspection → Solder Mask → Gold Plating → Hot Air Leveling → Character Printing → Outline Fabrication → Testing → Outgoing Inspection
Multi Layer Nickel, Gold Flash Board
Materiel Cutting → Drilling → Internal Circuit Pattern → Internal Etching → Inspection → Melanize → Pressing → Drilling → Plated Through Hole → External Circuit Pattern → Plating, Etching → Drilling → Inspection → Solder Mask → Character Printing → Outline Fabrication → Testing → Outgoing Inspection
