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| COB = Chip On Board, IC Bonding
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New Honest- Major in PCB’A manufacturing business. Provide you excellent service with high quality guarantee based on our professional COB production technology and experience.
Main Customer: Hosiden SONY OMRON Hyundai Musical Hitachi Brother Varitronix
Production Equipment: AB 510 AB 520A AB 530 AB 559A DS500 Full-automatic Epoxy Coating Mac
Production Experience:Aluminum wire and golden wire bonding manufacturing the PCBA of car display. Fully automatic epoxy coating.,multi IC Bonding ,The max quality of wire lines is 318 for each IC.
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Products Type:(Medical, Automotive, industrial and consumer product)
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| FPC : Gold Bonding , Ball Bonding |
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| Sensor FPC Gold Bonding , Ball Bonding |
LCM FPC Gold Bonding , Ball Bonding |
IC Gold bonding |
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| Wire Bonding Machine AB 520A |
Wire Bonding Machine AB530 |
Wire Bonding Machine AB 559A |
Die Bonding Machine Panasonic HW27U-H |
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| Oven |
Automatic Epoxy Coating Machine |
Function Tester |
IC Bonding -ball bonding |
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| Die Bonding Machine |
Ball Bonding Machine |
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AB520A |
AB530A |
AB559A |
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Pad pitch |
Min 80 um |
Min 80 um |
Min 80 um |
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Space of pad |
24 mil |
24 mil |
24 mil |
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High of Radian |
Min 100um |
Min 100um |
Min 100um |
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Diameter of wire |
20-50.4 um,0.8mail-2.0mil |
20-50.4 um,0.8mail-2.0mil |
20-50.4 um,0.8mail-2.0mil |
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Length of wire |
1 mm ~ 5mm |
1 mm ~ 5mm |
0.8 mm ~ 8mm |
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Precision of θ axis |
0.0036° |
0.0036° |
0.0036° |
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Precision of Z axis |
1um |
0.2um |
1um |
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Precision of X-Y |
0.625mm |
0.2um |
1um |
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Welding method |
Ultrasonic welding |
Ultrasonic welding |
Ultrasonic welding |
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Bonding area |
R = 12.5 mm |
R = 30 mm |
Max 208mm×106mm |
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Wires/Program |
5000 pcs |
5000 pcs |
16000pcs |
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PCB Size |
Max 180mm×80mm |
Max 180mm×80mm |
Max180mm×170mm | |
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